Samsung e laetse li-EUV tse 15, 'me ho thata ho fumana mochini oa Sesebelisoa

TSMC (2330) e phatlalalitse hore mofuta o matla oa 7-nm le theknoloji ea litho tsa litho tsa EU tsa 5-nm li kentsoe ka katleho 'marakeng. Mecha ea litaba ea Korea e tlaleha hore Samsung e laetse lisebelisoa tse 15 tsa EUV ho tsoa ho moetsi oa lisebelisoa tsa semiconductor ASML. Ntle le moo, Intel, Micron le leoatle Lux le tsona li rerile ho amohela theknoloji ea EUV, 'me ho na le liphasele tse ngata. Indasteri ea lefatše ea semiconductor e ikemiselitse ho loantša lisebelisoa tsa EUV (leseli le fetisisang la Ultraviolet).

TSMC haufinyane e phatlalalitse hore ts'ebetso e phahameng ea 7-nanometer e lebisang indastering ho kenya theknoloji ea litho tsa EUV e thusitse bareki ho kena 'marakeng ka bongata, mme tlhahiso e kholo ea li-nanometers tse 5 halofo ea pele ea 2020 le eona e tla kenngoa molemong oa Ts'ebetso ea EUV. Ho latela litlaleho tsa media tsa Korea, ho fihlela sepheo sa ho ba moqapi oa semiconductor oa lefats'e ka 2030, le ho fetisa moetapele oa mothehi oa TSMC ho hapa tlhokahalo ea mmaraka ea semiconductor e tlisoang ke thekiso ea 5G lilemong tse peli ho isa ho tse tharo, Samsung e se e ntse e le teng. lefats'e ka bophara Lisebelisoa tsa bonts'a lithography lithograph li laela lisebelisoa tse 15 tse tsoetseng pele tsa EUV.

Ntle le moo, Britt Turkot, hlooho ea lenaneo la Intel EUV, o itse theknoloji ea EUV e ikemiselitse ebile e tsetela kholisong e ngata ea mahlale. Li-giants tsa Memory Micron le Hynix le tsona li rerile ho hlahisa theknoloji ea EUV. Leha ho le joalo, lisebelisoa tsa hona joale tsa EUV ke ASML feela. Indasteri e hakanya hore ASML e ka hlahisa lisebelisoa tse ka bang 30 feela tsa EUV ka selemo, 'me lisebelisoa li thehiloe tlasa matsete a lifeme tse kholo. Ho thata ho fumana mochine, 'me ho emisa mochini le lisebelisoa tse ling.

Ka lebaka la bokhuts'oanyane bo potlakileng ba EUV ba li-nanometers tsa 13.5 tsa theknoloji e matla ea khanya, e ka sekaseka moralo oa ts'ebetso e tsoetseng pele, ea fokotsa palo ea mehato ea tlhahiso ea chip le palo ea likarolo tsa mask, mme ea kena phetolelong ea khoebo ho 5G, lebelo le phahameng haholo. -Frequency litšobotsi, 'me chip ke e nyane ebile e tlase. Litlhoko tsa matla a phahameng li fetohile theknoloji ea bohlokoa ea ho ntšetsa pele Molao oa Moore.

Leha ho le joalo, ho thata ho tseba sistimi ena e rarahaneng le e turang ho etsa palo e kholo ea lichifi. Le ha Samsung e phatlalalitse kenyelletso ea EUV ts'ebetsong ea li-nanometer tse 7, e kile ea tlaleha hore tlhahiso le tlhahiso e tlatsitsoeng ha e ea lekana. TSMC e boletse hore na hobaneng ha "EU-7m e qala EUV e sa isoa naheng, 'me ho hlokahala hore e fete ka koano ea ho ithuta ka lebaka la ho hlahisoa ha theknoloji e ncha. TSMC e ithutile ka katleho boiphihlelo ho mofuta o matla oa 7-nm, mme e ka hlahisa hantle ts'ebetso ea 5-nanometer nakong e tlang.